Fundraising September 15, 2024 – October 1, 2024
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1
中华人民共和国国家标准 GB/T14862-93 半导体集成电路封装结到外壳热阻测试方法=Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits
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trs
junction
thermal
abs
apb
arb
arh
bbe
beb
bef
bes
boe
brr
circuits
eft
enr
harrie
integrated
lak
methods
packages
raf
resistance
sear
semiconductor
temperature
tep
umm
vuc
3.80mm
880x1230
990sst
a2.1
a2.5
a2.6
a2.7
a3.1
a3.2
a3.3.1
arg
arge
arn
arse
asrs
avuc
awmeaey
babi
bake
bbb
Language:
chinese
File:
PDF, 7.61 MB
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